Image icon  Lift-off process for thin films production

 
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Description: The figure schematically shows the lift-off process for the production of thin-films structures using a sacrificial layer. The procedure is used in the semiconductor and microsystem technology, for example to produce metallic interconnections of semiconductor devices. The stages shown: 1. - Deposition of the sacrificial stencil layer on the substrate; 2. - Patterning the sacrificial layer (ex. etching), creating an inverse pattern; 3. - Depostion of the target material; 4. - Final pattern.
Keywords: semiconductor • metal • fabrication • deposition • thin film • sacrificial • surface • micro • scheme
Categories: Materials > Metals & alloys
Processes > Shaping > Deposition
Processes > Surface treatments
Properties > Electrical, magnetic & optical > Semiconductivity
Scale > Micro
Created by: Cepheiden
License: This resource is released under the Creative Commons Attribution Share Alike license (3.0 Unported).
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Date created: 20 August 2001
Date added: 17 January 2011
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Resource ID: 3335